MS313 - Meshfree and Other Advanced Numerical Methods for Applied Mechanics and Engineering Problems

Organized by: L. Wang (Tongji University, China), C. Zhang (University of Siegen, Germany) and Z. Zhong (Harbin Institute of Technology, China)
Keywords: advanced numerical simulations, machine learning methods, particle methods, peridynamics, strong-form collocation, Meshfree methods
Meshfree and Other Advanced Numerical Methods for Applied Mechanics and Engineering Problems TRACK NUMBER 1700 LIHUA WANG *, CHUANZENG ZHANG † AND ZHENG ZHONG § * School of Aerospace Engineering and Applied Mechanics, Tongji University 1239 Siping Road, 200092 lhwang@tongji.edu.cn † School of Science and Technology, University of Siegen, 57076 Siegen, Germany Center for Mechanics Plus under Extreme Environments, Ningbo University, 315211 Ningbo, China c.zhang@uni-siegen.de §School of Science, Harbin Institute of Technology, Shenzhen 518055, PR China zhongzheng@hit.edu.cn Keywords: Meshfree methods, particle methods, strong-form collocation, peridynamics, machine learning methods, advanced numerical simulations, applied mechanics and engineering problems. ABSTRACT Contributions in all subjects related to meshfree and other advanced numerical methods as well as their mechanics and engineering applications are welcome, which include but are not limited to the following topics:  Recent advances in meshfree methods, smoothed particle hydrodynamics, material point methods and other advanced numerical methods.  Recent advances in peridynamics and phase-field methods.  Recent advances in maching learning and other AI-based methods.  Applications of meshfree methods/machine learning and other numerical methods for the numerical simulation of advanced materials and structures, soft materials, inverse problems, fluid dynamics and fluid-structure interactions, geomechanics, large deformation and non-linear problems, multi-phase interactions, multi-field coupled problems, contact and impact, damage and fracture, static and dynamic structural responses, manufacturing processes, nano-mechanics, etc.