On the Application of Edge Detection Algorithms to Displacement Fields to Localize the Crack Tip

  • Diaz, Jorge G (Escuela de Ingeniería y Ciencias, Tecnológico)

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It is well known that crack tip location (CTL) profoundly influences the stress intensity factor. Numerical methods assume that the crack tip location (CTL) is known beforehand, which is not the case for experimental methods. This study describes how the CTL in cracked samples can be identified using image processing techniques, such as segmentation and edge detection algorithms, applied to displacement fields. The Sobel, Prewitt, Roberts, and Canny edge detection algorithms were applied to the displacement fields in the samples under mixed mode obtained using the Digital Image Correlation (DIC) technique. The coordinates established using a traveling optical microscope were compared with those established using the aforementioned algorithms. It was found to have a good correlation with visual methods using the stress intensity factor as a benchmark parameter. Furthermore, the error was lower in the opening mode than that in the parallel-to-load mode. For the samples under out-of-phase loading, the displacement fields were analyzed under maximum axial and torque loads, and the load-analyzed field should match. Finally, a sensitivity analysis of the effect of the CTL on the stress intensity factor in mode I and mixed mode was performed, highlighting the importance of appropriate placement. From the results obtained for the planar samples, it was evident that the v-field (perpendicular to the crack) presented better results for edge identification than the u-field (parallel to the crack) owing to the nature of the applied load. Therefore, matching the appropriate loading scenario with the analyzed displacement field is crucial for obtaining an accurate value of CTL. Finally, the proposed method is not dependent on the type of material. Hence, the proposed method can be applied to conductive or nonconductive, soft or hard, and isotropic or orthotropic materials.