With the rapid development of flexible electronic devices, hydrogel semiconductors have shown great potential for application in the fields of flexible electronics and biomedicine due to their excellent biocompatibility and mechanical properties. However, in practical applications, hydrogel electronic devices often face complex mechanical environments, and fatigue fracture behavior has become a key issue limiting their reliability and lifespan. This study systematically investigates the fatigue fracture behavior of hydrogel materials under cyclic loading through a combination of theoretical modeling, numerical simulations, and experimental validation. First, a multi-scale phase field model is developed to reveal the correlation mechanism between molecular-scale energy dissipation and macroscopic crack propagation in hydrogels. Secondly, a thermo-mechanical-chemical coupled phase field fracture model is established to study the effects of environmental factors such as temperature, pH value, ion concentration, and dynamic loading conditions on fatigue fracture behavior. This model comprehensively considers the mechanical response of hydrogel materials under different environmental conditions and reveals the influence mechanisms of environmental factors on fatigue life. Finally, combining machine learning methods, a fatigue fracture prediction model is built to accurately predict crack propagation paths under different operating conditions. This research can promote the development of fracture mechanics theory for hydrogels and provide important technical support for the engineering applications of hydrogel-based flexible electronic devices.