The die casting process is a manufacturing process in which molten metals are injected into a mold at high pressure and speed. Owing to its high productivity and dimensional accuracy, this process is widely used in the production of various industrial products. However, the die casting process is inherently prone to defects, including shrinkage porosity and non-equilibrium microstructures induced by rapid cooling. These defects can degrade the overall performance of cast products. Therefore, control of such defects is critical to ensure the quality of die-cast products. The process simulation with CFD (Computational Fluid Dynamics) is effective for improving the process to avoid defect formation. Since die casting process involves free surface and large deformation of the fluids, particle method is suitable for simulating die casting process. In particular, MPH (Moving Particle Hydrodynamics) method [1,2], which is based on analytical mechanical framework, has some advantages since it can handle a wide range of conditions stably. The authors have introduced some fundamental models in the MPH method and investigated the applicability of the MPH method for die casting simulations [3]. However, the proposed heat transfer model should be improved for practical process simulation and avoiding defect formations since it includes some assumptions. In this study, we introduced an improved heat transfer model into the MPH method which considers heat transfer between different materials. The model was verified by comparing the temporal temperature distribution with the analytic solution of the heat transfer equation. By comparing the temperature distribution obtained from the experiment using molten metal with calculation result, the practical effectiveness of the proposed model can be verified, and it is expected to contribute to more accurate simulations of the die casting process. REFERENCES [1] M. Kondo, Computational Particle Mechanics, Vol.8, pp.69-86, (2021). [2] M. Kondo, and J. Matsumoto, Vol. 385, 114072, (2021). [3] K. Akasaki, M. Kondo, H. Tokunaga, K. Shiga, J. Matsumoto, and K. Shibata, Vol. 97, Issue 12, pp.742-749, (2025). (in Japanese)