Prediction of Delamination at a Jointed 3D corner under Thermal Cyclic Loading using 3D corner SIFs
Please login to view abstract download link
Electronic devices often incorporate stacked layers of different materials to achieve multifunctionality and miniaturization. However, stress concentrations can arise in these stacked regions due to differences in material constants between the bonded materials. In this study, we applied the H-integral method within finite element analysis (FEA) to investigate the singular stress field around a sharp three-dimensional corner in joined heterogeneous materials. We determined the singularity eigenvalues　and scalar parameters, and further computed the stress intensity factor distribution around the corner. This approach is expected to predict both the direction and critical conditions for delamination originating from the sharp 3D corner. We propose an extended formulation of stress intensity factors (SIFs) for a sharp 3D corner in jointed disimilar materials. We analyzed the SIFs around a 3D corner under thermal cycles. We successfully predicted the initiation surface and the shape of delamination around the corner.
